Process of removing flux residue from microelectronic components
US5938856A · kind A · utility
23Cited by
24References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 1997 |
| Grant date | Aug 17, 1999 |
| Priority date | — |
| Expiry date | Jun 13, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/26
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
This invention relates to the use of non-halogenated and non-aromatic cleaning solvents as environmentally safe replacement of perchloroethylene and xylene to remove rosin flux residue formed on electronic circuit device materials during solder interconnection process for assembly of electronic components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.