Aryl cyanate and/or diepoxide and hydroxymethylated phenolic or hydroxystyrene resin
US5955543A · kind A · utility
5Cited by
17References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 21, 1997 |
| Grant date | Sep 21, 1999 |
| Priority date | — |
| Expiry date | May 21, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An adhesive for bonding a die of an integrated circuit chip comprises an aryl cyanate (ester) resin alone and/or a diepoxide resin admixed with a hydroxymethylated phenolic resin or hydroxymethylated poly(hydroxystyrene) which can further contain an electrically or thermally conductive filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.