Sensors for use in high vibrational applications and methods for fabricating same
US5955771A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 1997 |
| Grant date | Sep 21, 1999 |
| Priority date | — |
| Expiry date | Nov 12, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/147
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A hermetically sealed sensor device having a glass member defining a mounting surface and base surface, the glass member including one or more pin apertures extending through the glass member from the mounting surface to the base surface. A metallic pin is disposed in each of the pin apertures, each pin having a portion extending above the mounting surface. The sensor device also includes a semiconductor sensor chip including a semiconductor device and a cover hermetically bonded and sealed to a surface of the semiconductor device, the cover protecting the semiconductor device from the external environment. The is chip hermetically bonded and sealed to the mounting surface of glass member. The semiconductor device has one or more contacts disposed on the surface thereof, for making electrical contact thereto, the cover having one or more contact apertures extending therethrough which exposes a portion of the contacts. The portion of each pin extending above the mounting surface is received within the contact apertures and a conductive glass frit mixture disposed in the contact apertures, hermetically seals the contact apertures and provides electrical continuity between the pins an…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.