One-by-one type heat-processing apparatus
US5958140A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 1996 |
| Grant date | Sep 28, 1999 |
| Priority date | — |
| Expiry date | Jul 26, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67098
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A one-by-one type heat-processing apparatus is disclosed. The one-by-one type heat-processing apparatus includes a processing vessel for processing a semiconductor wafer. A susceptor having a support surface for placing the semiconductor wafer is arranged in the processing vessel. A shower head section is arranged at an interval with respect to the support surface of the susceptor. Processing gas supply pipes for supplying a processing gas are independently connected to the shower head section. A plurality of gas injection holes are formed in the shower head section. First to third heating means for heating the susceptor are attached to the susceptor. The first heating means having a disk-like shape is arranged at almost the center on the lower surface side of the susceptor. The second heating means is concentrically arranged to surround the first heating means. The third heating means is arranged at the peripheral edge portion of the susceptor. The diameter of a gas injection region having the plurality of gas injection holes on the surface of the shower head section opposite to the susceptor is substantially equal to the diameter of the third heating means. The apparatus also inc…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.