Lithographic proximity correction through subset feature modification
US5958635A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 20, 1997 |
| Grant date | Sep 28, 1999 |
| Priority date | — |
| Expiry date | Oct 20, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/143
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Lithographic Proximity Correction (LPC) shapes are added (503) to a layer of a layout database file (501). Geometric criteria such as feature width are then used to filter the added LPC shapes (502). The LPC shapes are then modified (505) by determining which LPC shapes are within a predetermined distance from a shape in a layer of the second data base (504). The database file, including the modified LPC shapes, is then used to manufacture a set of lithographic masks (506). The lithographic masks are then used to pattern a set of wafers in the manufacture of integrated circuits (507).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.