Method and apparatus for purging the back side of a substrate during chemical vapor processing
US5960555A · kind A · utility
61Cited by
8References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 16, 1997 |
| Grant date | Oct 5, 1999 |
| Priority date | — |
| Expiry date | May 16, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/455
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for purging the backside of a substrate in a process chamber includes a purge gas injector. The injector includes a substantially annular-shaped opening providing a slit that is structured and arranged to direct a flow of purge gas about radially outward therefrom in a direction approximately parallel to a plane defined by the substrate, wherein the substrate is supported in the process chamber above the purge gas injector. When the substrate is rotated at a sufficient speed, the purge gas flowing from the injector is impelled to flow spirally outward along the backside of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.