Method for using ultrasonic treatment in combination with UV-lasers to enable plating of high aspect ratio micro-vias
US5965043A · kind A · utility
46Cited by
46References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 8, 1996 |
| Grant date | Oct 12, 1999 |
| Priority date | — |
| Expiry date | Nov 8, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1383
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a via in a laminated substrate by forming ablated material by laser drilling a via in a laminated substrate. The ablated material is deposited on a sidewall of the via. An ultrasonic treatment is applied to the drilled substrate thereby removing ablated material redeposited on sidewalls of the via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.