Semiconductor package with molded plastic body
US5969414A · kind A · utility
13Cited by
22References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 25, 1994 |
| Grant date | Oct 19, 1999 |
| Priority date | — |
| Expiry date | May 25, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20752
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided a leadframe assembly for encapsulation in a polymer resin which prevents post-assembly fracture or swelling of the resin. The leadframe is coated with an adhesion enhancing layer that increases the shear stress required for delamination to in excess of about 3.4 MPa. In combination with this adhesion enhancing layer is a compliant die attach adhesive bonding an integrated circuit device to a central die attach paddle. This compliant die attach adhesive has a compliancy factor, E.multidot.a of less than 1.5 MPa/.degree.C. and a thickness of from about 0.01 mm to about 0.08 mm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.