High molecular weight silicone compound, chemically amplified positive resist composition and patterning method
US5972560A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 1998 |
| Grant date | Oct 26, 1999 |
| Priority date | — |
| Expiry date | Jan 30, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0757
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention provides a high molecular weight silicone compound comprising recurring units of the general formula (1) and having a weight average molecular weight of 1,000-50,000. ##STR1## Z is a di- to hexavalent, monocyclic or polycyclic hydrocarbon group or bridged cyclic hydrocarbon group of 5-12 carbon atoms, R.sup.1 is a substituted or unsubstituted alkyl or alkenyl group of 1-8 carbon atoms, R.sup.2 is an acid labile group, m is 0 or an integer, n is an integer, satisfying m+n.ltoreq.5, x is an integer, p1 and p2 are positive numbers, q is 0 or a positive number, satisfying 0<p1/(p1+p2+q).ltoreq.0.9, 0<p2/(p1+p2+q).ltoreq.0.9, 0.ltoreq.q/(p1+p2+q).ltoreq.0.7, and p1+p2+q=1. A chemically amplified positive resist composition comprising the high molecular weight silicone compound as a base resin is sensitive to actinic radiation and has a high sensitivity and resolution so that it is suitable for fine patterning with electron beams or deep UV. Since the composition has low absorption at the exposure wavelength of an ArF or KrF excimer laser, a finely defined pattern having walls perpendicular to the substrate can be readily formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.