Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
US5973403A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 19, 1997 |
| Grant date | Oct 26, 1999 |
| Priority date | — |
| Expiry date | Aug 19, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An inventive electronic device, such as a multi-chip module (MCM), a Single In-line Memory Module (SIMM), or a Dual In-line Memory Module (DIMM), includes a base, such as a printed circuit board, having a surface on which flip-chip pads and wire-bondable pads are provided. The flip-chip pads define an area on the surface of the base at least partially bounded by the wire-bondable pads. A first integrated circuit (IC) die is flip-chip bonded to the flip-chip pads, and a second IC die is back-side attached to the first IC die and then wire-bonded to the wire-bondable pads. As a result, the flip-chip mounted first IC die is stacked with the second IC die in a simple, novel manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.