Large area multiple-chip probe assembly and method of making the same

US5977787A · kind A · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Gobina Das · Hopewell Junction, US
• Paul M. Gaschke · Beacon, US
• Suryanarayan G. Hegde · Hollowville, US
• Mark R. LaForce · South Burlington, US
• Dale Curtis McHerron · Staatsburg, US
• Charles H. Perry · Poughkeepsie, US
• Frederick L. Taber, Jr. · Lagrangeville, US

Key dates

• Filing date: Jun 16, 1997
• Grant date: Nov 2, 1999
• Expiry date: Jun 16, 2017

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R1/07357
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A multiple-chip probe assembly suitable for wafer testing over a wide temperature range includes a plurality of individual buckling beam probe elements. A support structure supports the plurality of buckling beam probe elements in an arrangement in accordance with an electrical contact footprint for use in electrically contacting multiple chips of a wafer under test and enables buckling movement in a contacting direction of the plurality of buckling beams. The support structure includes a principal support material having a thermal coefficient of expansion (TCE) matched with the wafer under test and a second material other than the principal support material, wherein a contact positioning of the plurality of buckling beam probe elements upon the wafer under test during a testing operation is maintained. The second material prevents an individual probe element from electrically contacting the principal support material.