Electrostatic chuck having a thermal transfer regulator pad
US5978202A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 1997 |
| Grant date | Nov 2, 1999 |
| Priority date | — |
| Expiry date | Jun 27, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic chuck 75 for holding a substrate 25 in a process chamber 20, comprises an electrostatic member 80 including an insulator having an electrode 95 therein and a receiving surface for receiving the substrate. A base 85 supports the electrostatic member, the base having a first thermal resistance R.sub.B and having a lower surface that rests on the process chamber. A thermal transfer regulator pad 100 is positioned between the receiving surface of the electrostatic member and the lower surface of the base, the thermal pad comprising a second thermal resistance R.sub.P that is sufficiently higher or lower than the thermal resistance R.sub.B of the base, to provide a predetermined temperature profile across a processing surface of the substrate during processing in the chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.