Soldering with resilient contacts
US5980270A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 26, 1996 |
| Grant date | Nov 9, 1999 |
| Priority date | — |
| Expiry date | Nov 26, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49179
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of making a solder connection. An element bearing a solder mass is forcibly engaged with another element bearing a resilient metallic contact so that the contact wipes the surface of the solder mass and so that the contact is deformed and bears against the wiped surface. While the contact is in its deformed condition, the contact and solder mass are brought to an elevated bonding temperature sufficient to soften the solder, so that the contact penetrates into the solder mass under the influence of its own resilience. The contact bonds with the pure solder inside the solder mass, so that the effective bonding can be achieved even without flux.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.