Under-pad for chemical-mechanical planarization of semiconductor wafers
US5980363A · kind A · utility
106Cited by
3References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 1999 |
| Grant date | Nov 9, 1999 |
| Priority date | — |
| Expiry date | Jan 22, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S451/921
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention is an under-pad placed between a polishing pad and a platen of a planarizing machine used in chemical-mechanical planarization of semiconductor wafers. The under-pad has a body and a plurality of thermal conductors positioned in the body to conduct heat through the body. The body has a top face upon which the polishing pad is positionable and a bottom face engageable with the platen. In operation, heat from the platen and polishing pad flows through the thermal conductors to reduce temperature gradients across the planarizing surface of the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.