Multi-chip heat-sink cap assembly
US5981310A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 1998 |
| Grant date | Nov 9, 1999 |
| Priority date | — |
| Expiry date | Jan 22, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16251
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-chip module and heat-sink cap assembly and method of fabrication, which provides sufficient cooling for higher power density chips. The heat-sink cap has heat-sink columns disposed over each chip on a substrate. The heat-sink columns are interconnected by flexible members to provide a unitary cover. Thin film metallization of at least a portion of the mating surfaces of the substrate, chips and heat-sink column permits soldering of the cap to the chips and substrate to form the package which is a mechanically stable structure with no degradation of interconnection fatigue life due to thermal cycling of the assembly when in use.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.