Semiconductor packaging device
US5982625A · kind A · utility
9Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 1998 |
| Grant date | Nov 9, 1999 |
| Priority date | — |
| Expiry date | Mar 19, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor packaging device includes a printed circuit board substrate, a mold gate formed on a periphery of the printed circuit board substrate through which a package encapsulant is poured to enclose electric elements mounted on a side of the printed circuit board, and a layer of non-metallic material covered on the side of the printed circuit board substrate in the mold gate area. The package encapsulant, after hardened, is bonded with the layer of non-metallic material, and the bonded package encapsulant/the layer of non-metallic material is degatable from the mold gate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.