Kun-Ching Chen
20Patents
9h-index
24Co-inventors
71Inventor score
Filing activity: Mar 19, 1998 → Aug 5, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6680529B2 | Semiconductor build-up package | Electricity | 99 | Expired |
| US6737300B2 | Chip scale package and manufacturing method | Emerging Cross-Sectional Technologies | 85 | Expired |
| US6528882B2 | Thermal enhanced ball grid array package | Electricity | 76 | Expired |
| US6191360A | Thermally enhanced BGA package | Electricity | 61 | Expired |
| US6701614B2 | Method for making a build-up package of a semiconductor | Emerging Cross-Sectional Technologies | 52 | Expired |
| US6423622B1 | Lead-bond type chip package and manufacturing method thereof | Emerging Cross-Sectional Technologies | 27 | Expired |
| US6534852B1 | Ball grid array semiconductor package with improved strength and electric performance and method for making the same | Electricity | 25 | Expired |
| US7125745B2 | Multi-chip package substrate for flip-chip and wire bonding | Electricity | 15 | Expired |
| US6750397B2 | Thermally enhanced semiconductor build-up package | Electricity | 13 | Expired |
| US5982625A | Semiconductor packaging device | Electricity | 9 | Expired |
| US6455941B1 | Chip scale package | Electricity | 7 | Expired |
| US6313413A | Wire structure of substrate for layout detection | Electricity | 4 | Expired |
| US6642612B2 | Lead-bond type chip package and manufacturing method thereof | Emerging Cross-Sectional Technologies | 2 | Expired |
| US6551855B1 | Substrate strip and manufacturing method thereof | Electricity | 2 | Expired |
| US6714421B2 | Flip chip package substrate | Electricity | 1 | Expired |
| US7061084B2 | Lead-bond type chip package and manufacturing method thereof | Electricity | 0 | Expired |
| US8720053B2 | Process of fabricating a circuit board | Emerging Cross-Sectional Technologies | 0 | Active |
| US6190529A | Method for plating gold to bond leads on a semiconductor substrate | Electricity | 0 | Expired |
| US6252309A | Packaged semiconductor substrate | Electricity | 0 | Expired |
| US7061347B2 | High frequency substrate comprised of dielectric layers of different dielectric coefficients | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.