Internally cooled target assembly for magnetron sputtering
US5985115A · kind A · utility
29Cited by
102References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 11, 1997 |
| Grant date | Nov 16, 1999 |
| Priority date | — |
| Expiry date | Apr 11, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3455
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An internally cooled target assembly for use in a magnetron sputtering apparatus is provided. The internally cooled target assembly includes a cooling plate that is configured to promote highly turbulent coolant flow through the target assembly to achieve efficient and uniform target cooling. The volume of coolant required to cool the target assembly is minimized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.