Carboxyl-containing polyunsaturated fluxing adhesive for attaching integrated circuits
US5985456A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 9, 1997 |
| Grant date | Nov 16, 1999 |
| Priority date | — |
| Expiry date | Sep 9, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31938
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermally curable adhesive composition that includes a fluxing agent that also acts as an adhesive is provided. The composition includes: (a) a fluxing agent represented by the formula RCOOH, wherein R comprises a moiety having two or more carbon-carbon double bonds wherein in one embodiment, at least one is within an acrylate or methacrylate group, and which may further contain at least one aromatic moiety; (b) optionally, an effective amount of a crosslinkable diluent; (c) optionally, an effective amount of a source of free radical initiators; and (d) optionally, an effective amount of a resin to react with remnant carboxylic acid moieties. By employing an acrylate, methacrylate, or phenol in the structure of the adhesive flux, the cure temperature and moisture absorption characteristics can be significantly improved. The composition can be applied directly onto the surface(s) of devices that are to be joined electrically and mechanically. These devices include, printed circuit substrates, connectors, components, cables, and other electrical devices having metallization patterns to be soldered together by means of a solder-bumped pattern on one or both surfaces. Alternatively, …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.