Miguel Albert Capote
5Patents
0Active
5Granted
30Portfolio score
Filing activity: Sep 9, 1997 → Sep 7, 2001
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6297560A | Semiconductor flip-chip assembly with pre-applied encapsulating layers | Electricity | 169 | Expired |
| US6399426B1 | Semiconductor flip-chip package and method for the fabrication thereof | Electricity | 129 | Expired |
| US5985456A | Carboxyl-containing polyunsaturated fluxing adhesive for attaching integrated circuits | Emerging Cross-Sectional Technologies | 109 | Expired |
| US6518677B1 | Semiconductor flip-chip package and method for the fabrication thereof | Electricity | 100 | Expired |
| US6616984B1 | Forming viaholes in composition of cyanate, bismaleimide, epoxy resin and unsaturated aromatic glycidyl | Emerging Cross-Sectional Technologies | 2 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.