Method for making polishing pad with elongated microcolumns
US5989470A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 1, 1997 |
| Grant date | Nov 23, 1999 |
| Priority date | — |
| Expiry date | Aug 1, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S451/921
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad for use in chemical-mechanical planarization (CMP) of semiconductor wafers includes a multiplicity of elongated microcolumns embedded in a matrix material body. The elongated microcolumns are oriented parallel to each other and extend from a planarizing surface used to planarize the semiconductor wafers. The elongated microcolumns are uniformly distributed throughout the polishing pad in order to impart uniform properties throughout the polishing pad. The polishing pad can also include elongated pores either coaxial width or interspersed between the elongated microcolumns to provide uniform porosity throughout the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.