Microelectronic assembly fabrication with terminal formation from a conductive layer
US5989936A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 1997 |
| Grant date | Nov 23, 1999 |
| Priority date | — |
| Expiry date | Dec 12, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/063
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A structure including a conductive, preferably metallic conductive layer is provided with leads on a bottom surface. The leads have fixed ends permanently attached to the structure and free ends detachable from the structure. The structure is engaged with a microelectronic element such as a semiconductor chip or wafer, the free ends of the leads are bonded to the microelectronic element, and the leads are bent by moving the structure relative to the microelectronic element. Portions of the conductive layer are removed, leaving residual portions of the conductive layer as separate electrical terminals connected to at least some of the leads. The conductive layer mechanically stabilizes the structure before bonding, and facilitates precise registration of the leads with the microelectronic element. After the conductive layer is converted to separate terminals, it does not impair free movement of the terminals relative to the microelectronic element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.