Method for galvanic forming of bonding pads

US5989993A · kind A · utility

Assignees

• Elke Zakel · DE
• Pac Tech—Packaging Technologies Gmbh · DE

Inventors

• Elke Zakel · Falkensee, DE
• Rolf Aschenbrenner · Berlin, DE
• Andreas Ostmann · Berlin, DE
• Paul Kasulke · Berlin, DE

Key dates

• Filing date: Apr 22, 1996
• Grant date: Nov 23, 1999
• Expiry date: Apr 22, 2016

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/351
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Method for the preparation of electrodeposited or galvanically deposited bumps for the bonding of integrated circuits, characterized by two subsequent metal depositions, deposited without an external current source (chemical metal deposition) on a metallization 1, the first deposition being thicker than the second and the second deposition being more even or more regular throughout a large area than the first one.