Heat treatment apparatus
US5997651A · kind A · utility
39Cited by
5References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 10, 1996 |
| Grant date | Dec 7, 1999 |
| Priority date | — |
| Expiry date | Oct 10, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/481
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A heat treatment apparatus includes a treatment container having a reaction chamber, and a gas chamber a mount table provided in the treatment container for mounting thereon a wafer such that an upper surface of the wafer is exposed to the reaction chamber, and an annular clamp member provided in the reaction chamber, movable between a clamp position in which it contacts the peripheral edge of the wafer in circular line contact and a waiting position in which it is separated from the wafer. The line contact prevents leakage of the process gas from the reaction chamber through a clearance between the clamp member and the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.