Intelligent usage of first pass defect data for improved statistical accuracy of wafer level classification
US5999003A · kind A · utility
46Cited by
7References
4Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 12, 1997 |
| Grant date | Dec 7, 1999 |
| Priority date | — |
| Expiry date | Dec 12, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2837
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method to accurately classify defects on a semiconductor wafer wherein a scanning tool detects defects and assigns values to parameters that are characteristic of each defect. The values of the characteristic parameters represent a thumbprint of each defect and the defects are placed into "bins" according to the thumbprint of each defect. A sample of defects in each bin is analyzed and assigned a classification code.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.