Reactive ion etching of alumina/TiC substrates
US6001268A · kind A · utility
9Cited by
10References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 5, 1997 |
| Grant date | Dec 14, 1999 |
| Priority date | — |
| Expiry date | Jun 5, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/6011
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention is a method of patterning the air bearing surface of a ceramic slider preferably including alumina and titanium carbide. The method includes the steps of forming an etch pattern by depositing and developing a photoresist on the ceramic slider, and reactive ion etching the slider air bearing surface using an etchant gas of argon, sulfur hexafluoride, and methyltrifluoride flowing at a rate which provides a smooth patterned surface on the slider air bearing surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.