Process and system for flattening secondary edgebeads on resist coated wafers
US6001542A · kind A · utility
4Cited by
3References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 12, 1997 |
| Grant date | Dec 14, 1999 |
| Priority date | — |
| Expiry date | Dec 12, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/168
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method and system of flattening resist mounds formed during a wet edgebead operation. The wet edgebead operation is used to remove edgebeads formed when a resist material is deposited on a semiconductor wafer. Solvent is introduced to the semiconductor wafer at the area containing the resist mounds to soften them, and the semiconductor wafer is spun at a high speed to flatten the mounds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.