Process chamber and method for depositing and/or removing material on a substrate
US6017437A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 1997 |
| Grant date | Jan 25, 2000 |
| Priority date | — |
| Expiry date | Aug 22, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A processing chamber for depositing and/or removing material onto/from a semiconductor wafer when the wafer is subjected to an electrolyte and in an electric field. A hollow sleeve is utilized to form a containment chamber for holding the electrolyte. A wafer residing on a support is moved vertically upward to engage the sleeve to form an enclosing floor for the containment chamber. One electrode is disposed within the containment chamber while the opposite electrode is comprised of several electrodes distributed around the circumference of the wafer. The electrodes are also protected from the electrolyte when the support is raised and engaged to the sleeve. In one embodiment, the support and the sleeve are stationary during processing, while in another embodiment, both are rotated or oscillated during processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.