Apparatus and method utilizing an electrode adapter for customized contact placement on a wafer
US6022465A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 1998 |
| Grant date | Feb 8, 2000 |
| Priority date | — |
| Expiry date | Jun 1, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/001
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus and method for customizing electrode contact placement on a semiconductor wafer while depositing and/or removing a material on a semiconductor wafer. The present invention is a adapter having at least one opening through which at least one electrode contacts the semiconductor wafer. The adapter may be designed to have multiple openings at specified locations on the adapter, thus allowing multiple electrode contacts with the semiconductor wafer at pre-specified locations. A conductive sheet may couple with the adapter to carry an electrical current from an electrical conductor to the electrode contacts placed within the openings of the adapter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.