Substrate for semiconductor device, semiconductor device using the same, and method for manufacture thereof
US6022763A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 28, 1998 |
| Grant date | Feb 8, 2000 |
| Priority date | — |
| Expiry date | May 28, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A one-sided sealed type semiconductor device comprising a substrate proper for a one-sided resin mold provided on the first main surface thereof with a wiring circuit including connection parts for semiconductor elements and on the second main surface thereof with flat type external connection terminals led out thereon via a through hole, semiconductor elements set in place and packaged in predetermined areas of the first main surface of the substrate proper, a transfer mold resin layer for sealing solely the surface having the semiconductor elements packaged thereon, and a metallic layer formed on the first main surface independently of wiring circuit and outside the area having the wiring circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.