Inventor · Yokohama, JP

Jun Ohmori

14Patents
8h-index
10Co-inventors
65Inventor score

Filing activity: Jan 15, 1993 → Aug 22, 2002

Most-cited inventions

PatentTitleAreaCited byStatus
US6492718B2 Stacked semiconductor device and semiconductor system Electricity 147 Expired
USD369157S IC card General 88 Expired
US6054774A Thin type semiconductor package Electricity 43 Expired
US5780933A Substrate for semiconductor device and semiconductor device using the same Electricity 34 Expired
USD369156S IC Card General 33 Expired
US5547961A Method of treatment of intestinal diseases Chemistry; Metallurgy 20 Expired
USD368903S IC module General 20 Expired
US5956601A Method of mounting a plurality of semiconductor devices in corresponding supporters Electricity 12 Expired
US6022763A Substrate for semiconductor device, semiconductor device using the same, and method for manufacture thereof Electricity 6 Expired
US6462283B1 Semiconductor package with central circuit pattern Emerging Cross-Sectional Technologies 3 Expired
US6166431A Semiconductor device with a thickness of 1 MM or less Electricity 2 Expired
US5336679A Tetrahydroimidazopyridine derivatives and salts thereof Chemistry; Metallurgy 1 Expired
US6711815B2 Fabricating method of semiconductor devices Emerging Cross-Sectional Technologies 0 Expired
US6333212A Semiconductor device and manufacturing method thereof Electricity 0 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.