Method and apparatus for processing substrate
US6024502A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 29, 1997 |
| Grant date | Feb 15, 2000 |
| Priority date | — |
| Expiry date | Oct 29, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/135
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is an apparatus for processing a substrate in which a processing consisting of a plurality of process steps is applied to a substrate to be processed. The apparatus comprises a transfer zone extending in a vertical direction, a plurality of process groups arranged to surround the transfer zone for processing the substrate, each process group consisting of a plurality of process units stacked one upon the other, and each process unit having an opening communicating with the transfer zone for transferring the substrate into and out of the process unit, a main arm mechanism movably mounted in the transfer zone for transferring the substrate into and out of the process unit through the opening, and down flow forming means for forming a down flow of a clean air within the transfer zone. At least one of the plural process groups includes a plurality of thermal units for heating or cooling the substrate, a transfer unit for transferring the substrate into and out of the transfer zone, and a gas process unit for processing the substrate with a gas, the opening of the gas process unit being positioned lower than the openings of the thermal units and the transfer unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.