Method for detecting defects
US6025206A · kind A · utility
25Cited by
2References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 15, 1998 |
| Grant date | Feb 15, 2000 |
| Priority date | — |
| Expiry date | May 15, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for detecting defects comprises scanning a clean blank wafer for figuring out the quantity and locations of particles; then, scanning the wafer again after performing coating, exposure, and development processes on the wafer; comparing the two scanning results for figuring out the locations of the defects and calculating quantities of the defects by checking the patterns and colors, and then to obtain the quantities and types of the defects in mechanisms and photoresist respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.