Semiconductor device including a frame terminal
US6025650A · kind A · utility
149Cited by
4References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 1997 |
| Grant date | Feb 15, 2000 |
| Priority date | — |
| Expiry date | Oct 30, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention relates to a semiconductor device in which a plurality of outer terminals are arranged in a lattice formation on a flat surface. The semiconductor device comprises a semiconductor chip having a plurality of pads, a resin portion sealing said semiconductor chip and a terminal portion in which a prescribed number of pole terminals electrically connected to said pads provided in said semiconductor chip are provided, said pole terminals being exposed from said resin portion. According to the invention, a cost for production is reduced and a reliability and electrical characteristics can be improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.