Seiichi Orimo
12Patents
10h-index
32Co-inventors
64Inventor score
Filing activity: Mar 5, 1996 → Jun 1, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5656550A | Method of producing a semicondutor device having a lead portion with outer connecting terminal | Emerging Cross-Sectional Technologies | 267 | Expired |
| US6159770A | Method and apparatus for fabricating semiconductor device | Emerging Cross-Sectional Technologies | 172 | Expired |
| US6072239A | Device having resin package with projections | Emerging Cross-Sectional Technologies | 161 | Expired |
| US6025650A | Semiconductor device including a frame terminal | Electricity | 149 | Expired |
| US6433418B1 | Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism | Electricity | 122 | Expired |
| US6255740A | Semiconductor device having a lead portion with outer connecting terminals | Emerging Cross-Sectional Technologies | 75 | Expired |
| US6288444A | Semiconductor device and method of producing the same | Electricity | 56 | Expired |
| US6333564A | Surface mount type semiconductor device and method of producing the same having an interposing layer electrically connecting the semiconductor chip with protrusion electrodes | Electricity | 46 | Expired |
| US5930603A | Method for producing a semiconductor device | Electricity | 42 | Expired |
| US6094356A | Semiconductor device and semiconductor device module | Electricity | 13 | Expired |
| US6856017B2 | Device having resin package and method of producing the same | Emerging Cross-Sectional Technologies | 7 | Expired |
| US7144754B2 | Device having resin package and method of producing the same | Emerging Cross-Sectional Technologies | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.