Method of drying a substrate by lowering a fluid surface level
US6027574A · kind A · utility
25Cited by
11References
42Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 1998 |
| Grant date | Feb 22, 2000 |
| Priority date | — |
| Expiry date | Dec 18, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of removing liquid on a substrate, the method comprising the steps of placing the substrate in a fluid reservoir having a surface level, maintaining a partial pressure of vapor over the fluid surface level, lowering the fluid surface level of the reservoir while adding fluid, whereby the liquid flows off the substrate, and holding the substrate at different holding points, while lowering the fluid surface level so that the lowering surface level does not pass across a holding point that is being used to hold the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.