Hexagonal semiconductor die, semiconductor substrates, and methods of forming a semiconductor die
US6030885A · kind A · utility
41Cited by
10References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 18, 1997 |
| Grant date | Feb 29, 2000 |
| Priority date | — |
| Expiry date | Apr 18, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10156
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides for a hexagonal semiconductor die, semiconductor substrates and methods of forming a semiconductor die. One embodiment of the present invention provides a method of forming a semiconductor die comprising: providing a semiconductor wafer; forming an array of regular hexagonal dies upon the wafer, the array being formed in a two-dimensional honeycomb configuration; forming circuitry upon individual ones of the hexagonal dies; separating the hexagonal dies by laser cutting; and attaching a plurality of electrical contacts to the circuitry of individual ones of the hexagonal dies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.