Wafer support with improved temperature control
US6033478A · kind A · utility
50Cited by
23References
24Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 5, 1996 |
| Grant date | Mar 7, 2000 |
| Priority date | — |
| Expiry date | Nov 5, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatus for supporting a workpiece. The apparatus has either a mechanical or electrostatic chuck having a workpiece support surface that specifically directs the flow of a heat transfer gas from at least one gas supply port towards a drain port. A pressure valve beyond the drain port regulates heat transfer gas pressure to ensure adequate gas density for cooling by conduction and adequate gas flow for controlled leakage through the valve.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.