Semiconductor substrate and method of making same
US6033489A · kind A · utility
14Cited by
22References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 29, 1998 |
| Grant date | Mar 7, 2000 |
| Priority date | — |
| Expiry date | May 29, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12528
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor substrate is provided that exhibits very low substrate resistance while also providing structural integrity and robustness to resist breakage during manufacturing. The invention also provides methods of making these semiconductor substrates. The semiconductor substrate includes a planar surface and a recess extending below the planar surface. Preferred substrates include a plurality of recesses arranged in an array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.