Apparatus for retaining a workpiece in a process chamber within a semiconductor wafer processing system
US6034863A · kind A · utility
23Cited by
6References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 1997 |
| Grant date | Mar 7, 2000 |
| Priority date | — |
| Expiry date | Nov 12, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatus for retaining a workpiece in a process chamber of a semiconductor wafer processing system. The apparatus has a thermal transfer element, an electrostatic chuck on top of the thermal transfers element and a clamping ring that secures the chuck to the thermal transfer element in a predefined orientation. The detachable, "keyed" chuck permits rapid exchange of wafer support platforms for increased productivity and consistent placement of same upon the thermal transfer element for reliable processing conditions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.