Polishing apparatus
US6036582A · kind A · utility
40Cited by
7References
20Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 5, 1998 |
| Grant date | Mar 14, 2000 |
| Priority date | — |
| Expiry date | Jun 5, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23Q37/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing apparatus for polishing semiconductor wafers has a space divided into a plurality of rooms cleaned to different degrees. A storage unit for storing semiconductor wafers is disposed in one of the rooms. A polishing unit for chemically and mechanically polishing a semiconductor wafer supplied from the storage unit is disposed in another one of the rooms. A delivery gate is disposed between the storage unit and the polishing unit and has a temporary storage chamber defined therein for temporarily storing a semiconductor wafer therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.