Method of improved cavity BGA circuit package
US6040631A · kind A · utility
10Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 27, 1999 |
| Grant date | Mar 21, 2000 |
| Priority date | — |
| Expiry date | Jan 27, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved bonding system is provided in which a metal heat spreader is bonded to semiconductor chip. A two adhesive system is used in which a first adhesive demonstrates high bond strength with a second adhesive exhibits high thermal conductivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.