Patent · US Expired

Wiring structure having rotated wiring layers

US6043436A · kind A · utility

2Cited by

3References

5Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Harald D. Folberth · Böblingen, DE
J.o slashed.rgen Koehl · Tailfingen, DE
Bernhard Korte · Bonn, DE
Erich Klink · Schenefeld, DE

Key dates

Filing date	Feb 28, 1997
Grant date	Mar 28, 2000
Priority date	—
Expiry date	Feb 28, 2017

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3011
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An improved wiring structure to minimize coupling between the wiring in one metalization layer of an integrated circuit chip and the wiring in an adjoining metalization layer is described. Wiring in one layer is rotated by an angle a.sub.1 with respect to the direction of the wiring in the adjoining layer. By successively rotating all the conductors of one wiring layer with respect to the wiring of the next layer, the capacitive and inductive coupling between conductors in the various layers is minimized, thereby improving the overall high-frequency performance of the chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.