EMI containment for microprocessor core mounted on a card using surface mounted clips
US6043983A · kind A · utility
34Cited by
4References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 17, 1998 |
| Grant date | Mar 28, 2000 |
| Priority date | — |
| Expiry date | Jun 17, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0033
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic cartridge which includes a cover that is electrically coupled to a substrate by a clip. An integrated circuit package is mounted to the substrate and at least partially enclosed by the cover. The clips and cover may be connected to a ground plane of the substrate. The cover and substrate may create a "shield" about the integrated circuit package so that any electro-magnetic field that flows from the package is grounded to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.