Deposition method with improved step coverage
US6046097A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 23, 1999 |
| Grant date | Apr 4, 2000 |
| Priority date | — |
| Expiry date | Mar 23, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76843
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A deposition method for improving the step coverage of contact holes is disclosed. The method includes initially placing a semiconductor substrate on a chuck of a chamber, wherein the substrate has some contact holes. The chuck is firstly adjusted and conductive material is firstly deposited onto the substrate, wherein the direction of the first deposition is about vertical to the surface of the substrate, and therefore the bottom of the contact holes is then substantially deposited with the conductive material. Next, the chuck is secondly adjusted so that it has a tilt angle between the direction of the second deposition and rotation axis of the chuck. Finally, the chuck is continuously rotated and the conductive material is secondly deposited onto the substrate, and therefore the sidewall of the contact holes is then substantially deposited with the conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.