Method for mapping scratches in an oxide film
US6048745A · kind A · utility
2Cited by
11References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 28, 1997 |
| Grant date | Apr 11, 2000 |
| Priority date | — |
| Expiry date | Oct 28, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/959
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for detecting scratches on a wafer surface. The method comprises the use of a monitor wafer which has a substrate, a first layer deposited on the substrate, and a second layer deposited on the first layer. The first and second layers have contrasting work functions such that when short wavelength light is directed on the monitor wafer, scratches through the second layer can be detected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.