Gate/drain capacitance reduction for double gate-oxide DMOS without degrading avalanche breakdown
US6048759A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 11, 1998 |
| Grant date | Apr 11, 2000 |
| Priority date | — |
| Expiry date | Feb 11, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/112
Abstract
This invention discloses a DMOS power device supported on a substrate of a first conductivity type functioning as a drain. The DMOS power device includes a polysilicon-over-double-gate-oxide gate disposed on the substrate includes a polysilicon layer disposed over a double-gate-oxide structure having a central thick-gate-oxide segment surrounded by a thin-gate-oxide layer with a thickness of about one-fourth to one-half of a thickness of the thick-gate-oxide segment. The DMOS power device further includes a body region of a second conductivity type disposed in the substrate underneath the thin-gate-oxide layer around edges of the central thick-gate-oxide segment the body region extending out laterally to a neighboring device circuit element. The DMOS power device further includes a source region of the first conductivity type disposed in the substrate encompassed in the body region having a portion extending laterally underneath the thin-gate-oxide layer. The DMOS power device further includes an insulation layer covering the polysilicon-over-double-gate-oxide gate with contact openings above the substrate exposing the source region and the body region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.