Apparatus for achieving etch rate uniformity
US6051099A · kind A · utility
2Cited by
12References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 14, 1997 |
| Grant date | Apr 18, 2000 |
| Priority date | — |
| Expiry date | Oct 14, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32633
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A can for use in an etching system including a continuous conductive wall with a first opening to be placed adjacent the reactor upper electrode and a second opening to be placed adjacent the reactor lower electrode. Preferably, the conductive wall is a dual wall further including an inner wall and an outer wall, the inner and outer wall separated by one or more openings configured normal to the height of the continuous wall, the openings allowing for the flow of coolant through the wall.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.