Cost effective modular-linear wafer processing
US6053687A · kind A · utility
44Cited by
22References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 5, 1997 |
| Grant date | Apr 25, 2000 |
| Priority date | — |
| Expiry date | Sep 5, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/139
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An inventive module and fabrication system for processing semiconductor devices reduces the overall cost per unit processed, by eliminating the need for expensive rotational robots. The modules and fabrication system are configured so that wafer handlers are required to travel only along linear paths. The inventive modules may include an integral conveyor or may couple a remote conveyor. Preferably, the conveyor is positioned normal to the wafer handler's transport path in order to achieve the most compact footprint.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.