Chemical mechanical polish platen and method of use
US6056631A · kind A · utility
13Cited by
8References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 1997 |
| Grant date | May 2, 2000 |
| Priority date | — |
| Expiry date | Oct 9, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B27/0076
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present disclosure relates to a chemical mechanical polishing apparatus used for polishing wafers. The apparatus includes a polish platen and structure for separating the platen into at least first and second zones such that polishing fluid used in the first zone is prevented from entering the second zone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.